Heat dissipating light assembly
US11543115B1 · kind B1 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2021 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Jun 18, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light assembly may comprise a heatsink, a plurality of light emitting diodes, and a lens. The heatsink may include a first surface and a second surface opposite the first surface. The second surface may define an airflow path extending from a first end of the heatsink to a second end of the heatsink. The plurality of light emitting diodes may be coupled to the first surface of the heatsink. The lens may be located over the plurality of light emitting diodes and may contact the heatsink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.