Encapsulation methods for fluid-communicating magnetoelastic sensors

US11543465B2 · kind B2 · utility

Assignee

• THE REGENTS OF THE UNIVERSITY OF MICHIGAN · US

Inventors

• Scott Green · Maumee, US
• Yogesh B. Gianchandani · Madison, US
• Richard Kwon · Ann Arbor, US
• Grace Elta · Ann Arbor, US
• Jiqing Jiang · Sunnyvale, US
• Ramprasad Nambisan · Ann Arbor, US

Key dates

• Filing date: Apr 6, 2020
• Grant date: Jan 3, 2023
• Expiry date: Jan 13, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N11/16
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Encapsulation packages for stent-deployable monitoring devices formed of resonator sensors and allowing for magnetic biasing elements that exhibit a targeted impact on the mechanical characteristics of a stent are provided. Encapsulation packages are formed of different types and include a longitudinal shield and curved end on profile for aligning the shield within the deployable stent, the shield having perforations such that a resonator can be positioned adjacent the perforations for allowing particulate within the stent to collect and be measured by the resonator during deployment.