Grid clustering-based system for locating an abnormal area of solder paste printing and method thereof
US11544836B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Mar 18, 2021 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Jul 31, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A grid clustering-based system for locating abnormal area of solder paste printing and a method thereof are disclosed. In the system, an analysis device divides circuit board size information to generate divided grids based on grid size information, when a total number of at least one bad solder joint of one of the divided grids is determined to be higher than or equal to a density threshold value, the analysis device sets the one of divided grids as a high dense grid, the analysis device then integrates the divided grids, which are high dense grids and interconnected to each other, as a high-dense bad solder joint area. Therefore, the technical effect of integrating high dense areas of bad solder joint to locate the bad solder joint can be achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.