Apparatus for minimizing electromagnetic coupling between surface mount device inductors
US11546019B2 · kind B2 · utility
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21Claims
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Key dates
| Filing date | Dec 9, 2019 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Feb 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1003
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A surface mount device inductor has a package casing sized to attenuate electromagnetic coupling between the inductor coils of the surface mount device inductors. The package casing makes the surface mount device inductors self-shielding. The surface mount device inductors can be incorporated into a radiofrequency module, and can be incorporated into a front end system of a wireless mobile device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.