Resistor component for surface mounting on a printed circuit board and printed circuit board with at least one resistor component arranged thereon

US11547000B2 · kind B2 · utility

Assignee

• Heraeus Nexensos GmbH · DE

Inventors

• Stephan URFELS · Kleinostheim, DE
• Tim Asmus · Allendorf (Lumda), DE
• Stefan Dietmann · Haiterbach, DE
• Karlheinz Wienand · Aschaffenburg, DE

Key dates

• Filing date: Aug 7, 2019
• Grant date: Jan 3, 2023
• Expiry date: Aug 7, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K1/181
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

One aspect is a resistor component for surface mounting on a printed circuit board, including a ceramic substrate with a first side and an opposite second side. A sinterable metallization is at least in some regions arranged on the second side. A resistance element comprising a metal layer is arranged at least in some regions on the first side of the ceramic substrate with a first connection and a second connection. An insulation layer is arranged at least in some regions on the resistance element and the ceramic substrate. A first region on the first connection and a second region on the second connection remain uncovered by the insulation layer. A first contact pad electrically contacts the first connection via the first region, and a second contact pad electrically contacts the second connection via the second region. The first contact pad at least in some regions covers a first surface region of the insulation layer and the second contact pad at least in some regions covers a second surface region of the insulation layer, and the first and the second contact pads are arranged spatially separated from one another on the insulation layer.