Etching for bonding polymer material to anodized metal
US11547005B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2018 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Apr 2, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24545
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This application relates to a multi-piece enclosure for a portable electronic device. The enclosure includes a metal part including a metal substrate and a metal oxide layer overlaying the metal substrate, the metal oxide layer having an external surface that includes openings that lead into undercut regions. The openings are characterized as having a first width, and the undercut regions are characterized as having a second width that is greater than the first width. The enclosure further includes a non-metallic bulk layer including protruding portions that extend into the undercut regions such that the non-metallic bulk layer is interlocked with the metal part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.