Microplate and methods for making the same
US11548005B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 8, 2019 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Aug 5, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1062
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A microplate (10) includes a carrier (12) having a plate (20) and an annular perimeter wall (30) to define a recess (34). An array of holes (26) extends through the plate (20). A tape piece (16), die cut from a flexible tape (60) includes an array of wells (54) each extending through and having an opening (56) extending into the well (54). The array of wells (54) has a number and locations corresponding to the array of holes (26). The openings (56) have sizes corresponding to the holes (26). An upper surface (50) of the tape piece (16) is abutted with and bonded to the bottom face (24) of the plate (20) with the openings (56) corresponding to the array of holes (26). The slideable receipt of an annular outer periphery (58) of the tape piece (16) insures that the array of wells (54) are aligned to correspond to the array of holes (26) as die cutting of tape piece (16) insures that the array of wells (54) are at consistent positions relative to the annular outer periphery (58).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.