Method for applying a polymeric film to a substrate and resulting articles
US11548272B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 26, 2021 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Aug 26, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB44C1/105
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A polymeric film assembly comprising a first solidified interlayer on a polymeric film or laminate comprising the same that is contacted with at least a portion of a surface of an underlying article to provide, for example, desired surface characteristics. At least a portion of the first solidified interlayer becomes a softened interlayer positioned between the polymeric film and the surface of the article when contacted as such. The softened interlayer is then converted to a second solidified interlayer, which second solidified interlayer may be in a different form than or same form as the first solidified interlayer initially provided, for adherence of the polymeric film to at least the portion of the surface of the article. Ease of removal and/or repair of polymeric film and laminates comprising the polymeric film that are so applied is facilitated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.