Method of manufacturing head chip and method of manufacturing liquid jet head
US11548283B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2019 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Apr 22, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/12
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves on a surface of a piezoelectric substrate having one end and the other end so as to extend from the one end side toward the other end side, forming a conductive film on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area in the conductive film between the grooves adjacent to each other by performing laser processing from a start point on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoe…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.