Attachment of stress sensitive integrated circuit dies
US11548781B2 · kind B2 · utility
0Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2018 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Jul 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A die attachment to a support is disclosed. In an embodiment, a semiconductor package includes a support and a die attached to the support by an adhesive on a backside of the die, wherein the die includes a capacitive pressure sensor integrated on a CMOS read-out circuit, and wherein the adhesive covers only a part of the backside of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.