Polyimide copolymer and polyimide film using same
US11549013B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2018 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Mar 2, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyimide copolymer according to the present invention has a particular structure in which siloxane structures are distributed in a nanosize in a polymer and thus enables excellent transparency, heat resistance, mechanical strength and flexibility and effective reduction of residual stress, and thus can be used in various fields such as a substrate for a device, a cover substrate for a display, an optical film, an integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), tape, a touch panel and a protective film for an optical disk.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.