Resin composition and article made therefrom
US11549014B2 · kind B2 · utility
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14Claims
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Assignee
Inventors
Key dates
| Filing date | Jul 29, 2020 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Jul 1, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.