Dielectric substrate and method of forming the same
US11549035B2 · kind B2 · utility
6Cited by
31References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2021 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Dec 9, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0266
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.