Pressure sensitive adhesive composition and methods for its preparation and use in flexible organic light emitting diode applications
US11549039B2 · kind B2 · utility
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28References
5Claims
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Key dates
| Filing date | Oct 17, 2018 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Apr 1, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A pressure sensitive adhesive composition can cure via hydrosilylation to form a pressure sensitive adhesive. The pressure sensitive adhesive composition may be coated on a substrate and cured to form a protective film. The protective film is useful in flexible OLED device fabrication processes, e.g., for protection of passivation layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.