Method for densifying porous annular substrates by chemical vapour infiltration
US11549176B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2019 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Jul 24, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/46
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for densifying annular porous substrates by chemical vapour infiltration, includes providing a plurality of unit modules including a support plate on which is formed a stack of substrates, the support plate including a central gas inlet opening communicating with an internal volume formed by the central passages of the stacked substrates and gas outlet openings distributed angularly around the central opening, and a thermal mass cylinder disposed around the stack of substrates having a first end integral with the support plate and a second free end, forming stacks of unit modules in the chamber of a densification furnace, and injecting into the stacks of unit modules a gas phase including a gas precursor of a matrix material to be deposited within the porosity of the substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.