Electroplating method
US11549189B1 · kind B1 · utility
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1References
7Claims
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Key dates
| Filing date | Mar 4, 2022 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Mar 4, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D15/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure provides an electroplating method, comprising providing an electroplating solution, wherein the electroplating solution includes an effective microorganisms aqueous solution and metal chloride; disposing a workpiece, wherein at least a part of the workpiece is in contact with the electroplating solution; and performing an electroplating process to electroplate metal of the metal chloride onto the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.