Thermal enclosure
US11549635B2 · kind B2 · utility
0Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2017 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Jun 26, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed between the plates, and a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient. Multiple such sets of plates may be used to form an enclosure for a device that thermally insulates the device from ambient.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.