Photonics optoelectrical system
US11550099B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2019 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Feb 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F30/21
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
There is set forth herein a method including building a first photonics structure using a first wafer having a first substrate, wherein the building the first photonics structure includes integrally fabricating within a first photonics dielectric stack one or more photonics device, the one or more photonics device formed on the first substrate; building a second photonics structure using a second wafer having a second substrate, wherein the building the second photonics structure includes integrally fabricating within a second photonics dielectric stack a laser stack structure active region and one or more photonics device, the second photonics dielectric stack formed on the second substrate; and bonding the first photonics structure and the second photonics structure to define an optoelectrical system having the first photonics structure bonded the second photonics structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.