Patent · US Active

Advanced thermal compensation of mechanical processes

US11550291B2 · kind B2 · utility

0Cited by

3References

15Claims

0Family size

Assignee

HEXAGON TECHNOLOGY CENTER GMBH · CH

Inventors

Claudio ISELI · Au, CH
Bernd Reimann · Heerbrugg, CH
Michael Schlenkrich-Erasmus · Baldham, DE
Jürgen Schneider · Linden, DE
Katrin Mentl · Lawrenceville, US
Roland Burgstaller · Höchst, AT
Frank Lamping · Waldgirmes, DE
Alexandre HEILI · Altstätten, CH
Asif Rana · Heerbrugg, CH
Beat Aebischer · Heerbrugg, CH

Key dates

Filing date	Dec 4, 2020
Grant date	Jan 10, 2023
Priority date	—
Expiry date	Apr 16, 2041

Classification

Technology area (CPC G)Physics
CPC primaryG05B2219/35015
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A computer program product and to a method for compensating thermal errors in a mechanical process, the mechanical process in particular provided by a mechanical device such as a coordinate measuring machine, a tooling machine or an articulated robot arm. Thermal errors arise due to thermal disturbances affecting the mechanical process, wherein thermal disturbances may arise from environmental influences affecting the mechanical process or from internally generated changing temperature distributions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.