Dielectric composition, dielectric thin film, dielectric element, and electronic circuit board
US11551867B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Sep 28, 2020 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Jun 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/33
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a dielectric composition having high relative permittivity and insulation resistance at high temperature. The dielectric composition includes a main component expressed by a compositional formula (Sr1-x, Cax)m(Ti1-yHfy)O3-δNδ, in which 0<x≤0.15, 0<y≤0.15, 0.90≤m≤1.15, and 0<δ≤0.05 are satisfied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.