Solution-based deposition method for preparing semiconducting thin films via dispersed particle self-assembly at a liquid-liquid interface
US11551928B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2018 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Aug 3, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for preparing a semiconducting thin film and device for carrying out the method, wherein the method includes: (1) providing a liquid-liquid interface; (2) providing at least one layered semiconductor material or its precursor(s) in the form of particles in a solvent in the form of a dispersion; (3) injecting the dispersion at the liquid-liquid interface, in order to obtain an assembly of semiconductor/semiconductor precursor particles; (4) bringing the assembly of into contact with a flexible substrate; and (5) applying a surface pressure to the dispersion to obtain a particle film of semiconductor/semiconductor precursor on the substrate, wherein the first solvent has a higher density than the second solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.