Contact between interconnect and electrode
US11552306B2 · kind B2 · utility
0Cited by
4References
12Claims
0Family size
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Inventors
Key dates
| Filing date | Jun 4, 2021 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Jul 1, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Improved contact between interconnect and oxygen electrode material is achieved through a contact point between an electrode or a contact layer and a coated ferritic stainless steel interconnect, where the coating on the metallic interconnect comprises Cu.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.