Transmission line board, and joint structure of transmission line board
US11553588B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2021 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Sep 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0298
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A transmission line board includes an insulating substrate including a first principal surface, first and second signal lines, first and second signal electrodes, which are provided at the insulating substrate. The first signal electrode is connected to the first signal line, and is connected by capacitive coupling to a different circuit board. The second signal electrode is connected to the second signal line, and is connected to the different circuit board via a conductive binder. The first signal line is provided to transmit a signal in a first frequency band, and the second signal line is provided to transmit a signal in a second frequency band lower than the first frequency band.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.