Wireless machine condition monitoring device
US11553594B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2020 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Aug 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A condition monitoring device configured to be mounted on a machine for sensing, for example, vibrations produced by the machine during operation, includes a base, a printed circuit board assembly lying in a first plane, and first and second fasteners, each having a longitudinal axis, lying in a second plane perpendicular to the first plane, the first and second fasteners extending through the printed circuit board assembly and into the base. A third plane is perpendicular to the first and second planes and is located halfway between the longitudinal axes of the first and second fasteners. An integrated power supply is connected to the printed circuit board assembly, and at least two active sensing cells, such as vibration sensors, are arranged symmetrically relative to the second plane and/or symmetrically relative to the third plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.