Systems and methods for removing an adhesively-attached component from a circuit board assembly
US11553631B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2020 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Feb 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/176
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus and associated methods relate to removing an adhesively-attached component from a circuit board assembly. A complementary pair of high-permeability members are positioned on opposite sides of the circuit board assembly about the adhesively-attached component. Then, a magnetic field is induced within the complementary pair of high permeability members via a coil driver generating an AC current in an inductive coil circumscribing a central pedestal of the complementary pair of high-permeability members. The magnetic field induced is directed through the adhesively-attached component via a central pedestal located proximate the adhesively-attached component. A return path for the magnetic field is provided about a periphery of the adhesively-attached component via a peripheral pedestal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.