Method for monitoring quality of hot stamped components
US11554404B2 · kind B2 · utility
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3References
16Claims
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Key dates
| Filing date | Mar 16, 2020 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Apr 30, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D2211/008
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A controller alters a cycle time of a die arrangement, configured to hot stamp metal into components and having an active cooling system, based on an amount of heat transferred from the components to the active cooling system such that a grain structure of the components transitions from an austenitic state to a martensitic state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.