Device for a laser machining system, and laser machining system having a device of this kind
US11554447B2 · kind B2 · utility
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1References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 6, 2019 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Dec 6, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B27/0955
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A device for a laser machining system includes a laser beam optics for a machining laser beam with an arrangement of optical elements arranged one after the other in a beam path of the machining laser beam. With respect to a direction of propagation of the machining laser beam, a first outermost optical element of the arrangement of optical elements consists of a material with a thermal conductivity coefficient kT of 2 W/(m·K) or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.