Fused filament fabrication of shape memory alloys
US11554536B2 · kind B2 · utility
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Key dates
| Filing date | Nov 13, 2020 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Nov 14, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method may include fused filament fabricating a fused filament fabricated component by delivering a softened filament to selected locations at or adjacent to a build surface. The softened filament may include a sacrificial binder and a powder including a shape memory alloy (SMA). The method also may include removing substantially all the sacrificial binder from the fused filament fabricated component to leave an unsintered component; and sintering the unsintered component to join particles of the SMA and form an SMA component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.