Method and device for embossing planar material
US11554570B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 2017 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Aug 13, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB31F2201/0743
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for embossing a first grating in a planar material, by means of an embossing body and a counter embossing body, having each a hard surface, the first grating to be embossed comprising alternating substantially parallel and straight ridges and recesses, whereby the top surfaces of the ridges are intended to weaken a direct angular reflection of light by diffuse omnidirectional reflection, thereby producing a visible contrast between the ridges and the recesses. The method comprises on the embossing body providing a first plurality of obtuse pyramids intended to emboss the recesses of the first grating by exerting pressure on a first side of the planar material, the first plurality of obtuse pyramids forming first intermitted lines (row1, row2) corresponding to the intended recesses, and the pyramids in each subset corresponding to one of the first intermitted lines, being separated from each other by a determined distance that creates a gap in the line in such a manner that each gap from a line of pyramids may be connected to a corresponding gap from an adjacent line of pyramids by an imaginary line perpendicular to both of the adjacent lines; and roughening portions of the…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.