Method for closing openings in a flexible diaphragm of a MEMS element
US11554952B2 · kind B2 · utility
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1References
12Claims
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Key dates
| Filing date | Dec 20, 2018 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Aug 15, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0197
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for closing openings in a flexible diaphragm of a MEMS element. The method includes: providing at least one opening in the flexible diaphragm, situating sealing material in the area of the at least one opening, melting-on at least the applied sealing material in the area of the at least one opening, and subsequently cooling the melted-on material to close the at least one opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.