Satin copper bath and method of depositing a satin copper layer
US11555252B2 · kind B2 · utility
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25References
16Claims
0Family size
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Key dates
| Filing date | Nov 1, 2019 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Nov 1, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An aqueous acidic copper electroplating bath that produces a satin deposit includes a source of copper ions, an acid, a satin additive, and optionally one or more acidic copper electroplating bath additive(s), wherein the satin additive includes a block copolymer with the structure of RO(EO)m(PO)nH.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.