Method and system for analyzing 2D material thin film
US11555996B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2021 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Apr 20, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for analyzing 2D material thin film and a system for analyzing 2D material thin film are disclosed. The detection method includes the following steps: capturing sample images of 2D material thin films; measuring the 2D material thin films by a Raman spectrometer; performing a visible light hyperspectral algorithm on the sample images by a processor to generate a plurality of visible light hyperspectral images; performing a training and validation procedure, performing an image feature algorithm on the visible light hyperspectral images, and establishing a thin film prediction model based on a validation; and capturing a thin-film image to be measured by the optical microscope, performing the visible light hyperspectral algorithm, and then generating a distribution result of the thin-film image to be measured according to an analysis of the thin film prediction model.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.