RF chirp reduction in MZ modulator
US11556042B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2018 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Oct 17, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2203/255
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A waveguide structure for use in a balanced push-pull Mach Zehnder modulator. The waveguide structure comprises a plurality of layers. The layers comprise, in order: an insulating or semi-insulating substrate; an lower cladding layer; an waveguide core layer; and an upper cladding layer. The lower cladding layer, waveguide core layer, and upper cladding layer are etched to form: a signal waveguide and a ground waveguide, which are connected via the lower cladding layer; and a signal line and a ground line, each located adjacent to the respective waveguide, and each connected to the respective waveguide via one or more respective resistive structures connected in the plane of the lower cladding layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.