Heat sink and circuit device
US11557521B2 · kind B2 · utility
1Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2018 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Oct 27, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B70/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.