Electronic circuit device and method of manufacturing electronic circuit device
US11557542B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 30, 2020 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Dec 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06586
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic circuit device according to the present invention includes a base substrate including a wiring layer having a connection part, at least one electronic circuit element, and a re-distribution layer including a photosensitive resin layer, the photosensitive resin layer enclosing a surface on which a connection part of the electronic circuit element is formed and a side surface of the electronic circuit element and embedding a first wiring photo via, a second wiring photo via and a wiring, the first wiring photo via directly connected to the connection part of the electronic circuit element, the second wiring photo via arranged at the outer periphery of the electronic circuit element and directly connected to a connection part of the wiring layer, the wiring electrically connected to the first wiring photo via and the second wiring photo via on a same surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.