Flexible wiring for low temperature applications
US11557709B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 7, 2017 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Sep 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The subject matter of the present disclosure may be embodied in devices, such as flexible wiring, that include: an elongated flexible substrate; multiple electrically conductive traces arranged in an array on a first side of the elongated flexible substrate; and an electromagnetic shielding layer on a second side of the elongated flexible substrate, the second side being opposite the first side, in which the elongated flexible substrate includes a fold region between a first electronically conductive trace and a second electrically conductive trace such that the electromagnetic shielding layer provides electromagnetic shielding between the first electronically conductive trace and the second electrically conductive trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.