Patent · US Active

Double-sided cooling of laser diodes

US11557874B2 · kind B2 · utility

1Cited by

30References

18Claims

0Family size

Assignee

TRUMPF Photonics, Inc. · US

Inventors

Prasanta Modak · Plainsboro, US
Stefan Heinemann · Ann Arbor, US
Berthold Schmidt · Küsnacht (ZH), CH

Key dates

Filing date	May 18, 2021
Grant date	Jan 17, 2023
Priority date	—
Expiry date	Jul 1, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01S5/0287
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Methods, devices, and systems for double-sided cooling of laser diodes are provided. In one aspect, a laser diode assembly includes a first heat sink, a plurality of submounts spaced apart from one another on the first heat sink, a plurality of laser diodes, and a second heat sink on top sides of the plurality of laser diodes. Each laser diode includes a corresponding active layer between a first-type doped semiconductor layer and a second-type doped semiconductor layer. A bottom side of each laser diode is positioned on a different corresponding submount of the plurality of submounts. The plurality of laser diode are electrically connected in series.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.