Diode laser
US11557881B2 · kind B2 · utility
1Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2018 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | May 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/405
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to a laser assembly (1) comprising a diode laser bar (2), a heat sink (4) and at least one cover (7). The laser bar is located between the heat sink and the cover. The heat sink and/or the cover is/are coated with nanowires (16) or nanotubes via which the contact between the laser bar and the heat sink and/or the cover is established.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.