Integrated lens mount and heat sink
US11558535B2 · kind B2 · utility
0Cited by
0References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2021 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | May 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/56
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A camera assembly for an interior of an automobile is disclosed. The camera assembly includes a lens, an image sensor, a printed circuit board, at least one illuminator, and a lens mount. The lens, image sensor and at least one illuminator are operatively connected to the printed circuit board. The lens mount includes at least one integrated heat sink configured to dissipate heat from the at least one illuminator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.