Ground discontinuities for thermal isolation
US11558955B2 · kind B2 · utility
0Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2020 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Mar 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10363
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.