Shape memory thermal capacitor and methods for same
US11558957B2 · kind B2 · utility
1Cited by
13References
23Claims
0Family size
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Key dates
| Filing date | Jun 12, 2020 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Jan 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10416
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic assembly including a thermal capacitor. An electronic substrate of the electronic assembly includes one or more insulating layers and one or more conductor layers provided along the one or more insulating layers. The one or more conductor layers including a conductive material. A shape memory thermal capacitor is received in the electronic substrate. The shape memory thermal capacitor includes a shape memory core including a shape memory material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.