Printed circuit board
US11558959B2 · kind B2 · utility
0Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2021 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Apr 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes an insulating layer, a circuit pattern embedded in the insulating layer and including a first metal layer, a second metal layer and a third metal layer disposed between the first metal layer and the second metal layer, and a connection conductor disposed on one surface of the insulating layer and connected to the circuit pattern, wherein the first metal layer is exposed through the one surface of the insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.