Thermoformable film
US11560468B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2020 |
| Grant date | Jan 24, 2023 |
| Priority date | — |
| Expiry date | Oct 1, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2314/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoformable film including a polyethylene composition. The polyethylene composition includes a first polyethylene which is an ethylene copolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution Mw/Mn of <2.3, a second polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of less than 75,000 and a molecular weight distribution Mw/Mn of <2.3, a third polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of less than 75,000 and a molecular weight distribution Mw/Mn of <2.3, and a fourth polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 100,000 to 250,000 and a molecular weight distribution Mw/Mn of >2.3, where the first polyethylene has more short chain branching than the second polyethylene or the third polyethylene. The polyethylene composition has a melt flow ratio (I21/I2) of ≤55 and an area Dimensional Thermoformability Index (aDTI) at 105° C. of less than 15.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.