Microelectromechanical inertial sensor including a substrate and an electromechanical structure situated on the substrate
US11561238B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Oct 4, 2019 |
| Grant date | Jan 24, 2023 |
| Priority date | — |
| Expiry date | Dec 2, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01C19/5776
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A microelectromechanical inertial sensor including a substrate and an electromechanical structure situated on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.