High density optical I/O inside a data center switch using multi-core fibers
US11561352B2 · kind B2 · utility
1Cited by
14References
8Claims
0Family size
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Key dates
| Filing date | Jul 14, 2020 |
| Grant date | Jan 24, 2023 |
| Priority date | — |
| Expiry date | Jul 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B10/801
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect has a first end coupled to the MCM and a second end connected to the optical-to-optical connector on the panel, for routing the plurality of optical communication signals between the MCM and the panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.