Power semiconductor module and method of forming the same
US11562911B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2020 |
| Grant date | Jan 24, 2023 |
| Priority date | — |
| Expiry date | Jul 23, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment provides a method of providing a power semiconductor module with a cooler. A power semiconductor module includes a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side is connected to a first baseplate side and the baseplate also includes a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler. The cooler includes a first casing component and a second casing component. The baseplate side is equipped with a cooling area that is surrounded by a connecting area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.