Backplane and manufacturing method thereof, backlight module, and display panel using micro light-emitting diodes
US11562991B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 26, 2020 |
| Grant date | Jan 24, 2023 |
| Priority date | — |
| Expiry date | Aug 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A backplane, a manufacturing method thereof, a backlight module and a display panel are provided. The backplane includes a base substrate; a first conductive layer located on the base substrate and including a wire; a first protection layer located at a side of the first conductive layer facing away from the base substrate; a second conductive layer located on the first protection layer and including a conductive sub-layer, the conductive sub-layer penetrating the first protection layer to be connected with the wire; a second protection layer located at a side of the second conductive layer facing away from the base substrate; a micro light-emitting diode (LED) penetrating the second protection layer to be connected with the conductive sub-layer; and a metallic reflective layer, located on the second protection layer and configured to reflect light irradiated onto the metallic reflective layer from the micro LED.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.