Patent · US Active

Carrier substrate with a thick metal interlayer and a cooling structure

US11564307B2 · kind B2 · utility

0Cited by

23References

13Claims

0Family size

Assignee

ROGERS GERMANY GMBH · DE

Inventors

Andreas Meyer · Speichersdorf, DE
Vitalij Gil · Hersbruck, DE
László Müller · Allentown, US
Rainer Herrmann · Hamburg, DE
Stefan Britting · Schnaittach, DE

Key dates

Filing date	Dec 19, 2017
Grant date	Jan 24, 2023
Priority date	—
Expiry date	Feb 21, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/3121
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The present invention proposes a carrier substrate (1) for electrical components (13), the carrier substrate (1) having a component side (4) and a cooling side (5) which is opposite the component side (4) and has a cooling structure (30), the carrier substrate (1) comprising a primary layer (10) which faces the component side (4) and is produced from ceramic for electrical insulation, and a secondary layer (20) which faces the cooling side (5) for stiffening the carrier substrate (1), characterized in that a metallic intermediate layer (15) is arranged between the primary layer (10) and the secondary layer (20) for heat transfer from the component side (4) to the cooling side (5), the metallic intermediate layer (15) being thicker than the primary layer (10) and/or the secondary layer (20).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.