Patent · US Active

3D printing of biomedical implants

US11565026B2 · kind B2 · utility

0Cited by
9References
2Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 5, 2021
Grant dateJan 31, 2023
Priority date
Expiry dateJul 29, 2041

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08J2367/06
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

Provided herein are methods, compositions, devices, and systems for the 3D printing of biomedical implants. In particular, methods and systems are provided for 3D printing of biomedical devices (e.g., endovascular stents) using photo-curable biomaterial inks (e.g., or methacrylated poly(diol citrate)).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.