Atomic layer etching on microdevices and nanodevices
US11565936B2 · kind B2 · utility
0Cited by
2References
17Claims
0Family size
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Key dates
| Filing date | May 25, 2017 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Dec 7, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y30/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to the unexpected discovery of novel methods of preparing nanodevices and/or microdevices with predetermined patterns. In one aspect, the methods of the invention allow for engineering structures and films with continuous thickness equal to or less than 50 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.